In the world where technology is growing at rapid pace and beyond our imagination it’s really tough to stay calm if our work is delayed, even by a second. Every now and then we get to hear the word “COMPACT” for our personal computers. Some one reduces the size of the chips or some one replaces the Hard Disk with Flash drives. Solely for the reason of staying ahead of the competition and giving something new and innovative to it’s people. Realized that the time is very near when we have reached a point of approaching the physical limits of these processes.
But then this happened:
3M & IBM, the Tech Giants have came up with a unique Glue that allow them to stack chips up to 100 semiconductor layers. Now that’s koool. But what’s Superkoool, is that
“This Glue will not only stack these chips electronically, but also dissolve the heat generated during operation”
"Today's chips, including those containing 3D transistors, are in fact 2D chips that are still very flat structures," explained Bernie Meyerson, a vice president of IBM Research, during the press conference. "Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor – a silicon skyscraper. We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low – key requirements for many manufacturers, especially for makers of tablets and smart phones."
Mr. Timothy Prickett Morgan of Theregister.co.uk has explained the concept really well:
“The idea is to take components that are often separate on a system – processors, main memory, networking and other peripherals – and etch them all onto chips and then stack them up in a 3D array, rather than solder them onto a motherboard and wire them together with metal stripes in a 2D array. By going 3D, the wires between components can not only be shortened - cutting the time those components need to exchange signals and potentially requiring less energy to send a signal.”
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